3D packaging 졸업 논문
- 최초 등록일
- 2013.06.10
- 최종 저작일
- 2010.11
- 17페이지/ MS 파워포인트
- 가격 3,000원
소개글
신소재공학부 졸업논문 발표자료입니다. 주제는 3D Packaging에 관한 내용입니다.
목차
1.3D packaging
2.purpose
3.experiment
4.data&result
5.summary
본문내용
Summary
Cu pillar bump was formed by electroplating.
Electrical property and fine structures in bonding layer is observed differently with the bonding temperature.
We have to consider that bonding temperature, mechanical property of materials and temperature that device stands.
참고 자료
Riet Labie, Wouter Ruythooren, Kris Baert, Eric Beyne and Bart Swinnen IEEE Xplore. Restrictions apply.(2008)
K. Tanida, M. Umemoto, N. Tanaka, Y. Tomita and K. Takahashi, Japanese Journal of Applied Physics 43, 22642270(2004)
Ho-Young Son, Gi-Jo Jung, Jun-Kyu Lee, Joon-Young Choi, and Kyung-Wook Paik “Cu-SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip”, Fig. 2 (c) (2007)
D.R Frear, S. N. Burchett, H. S. Morgan, J. H. Lau : The Mechanics of solder Alloy Interconnects Van Nostrand Reinhold New York p.60
http://www.tradekorea.com/productdetail/P00032217/Solder_Bump.html
http://wesrch.com/wiki112