저온실링용 ZnO-V2O5-P2O5계 봉착재의 물성에 미치는 TiO2 의 영향

서지정보

ㆍ발행기관 : 한국재료학회 ㆍ수록지정보 : 한국재료학회지 / 19권 / 11호
ㆍ저자명 : 이헌석, 황종희, 임태영, 김진호, 이석화, 김일원, 김남석, 김형순

영어 초록

We designed new compositions for lead free and low temperature sealing glass frit of ZnO-V2O5-P2O5 system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The ZnO-V2O5-P2O5 system can be used as a sealing material at temperatures even lower than 430˚C. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added TiO2 as a promoter for bonding strength. We examined the effect of TiO2 addition on sealing behaviors of ZnO-V2O5-P2O5 glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of ZnO-V2O5-P2O5 system glasses were improved with TiO2 addition, but showed a maximum value at 5 mol% TiO2 addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

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