고출력 LED 패키지 기술

소개글

현재까지 고출력 LED 패키지 기술과 기술 동향, 고출력 구동에 필요한 방열 대책 및 재료, 설계 등의 내용을 정리한 자료입니다.

목차

Introduction
Thermal Management of LED
High Power Packaging
LED Package Materials
LED Packaging Structure
LED Packaging Technical Roadmap

본문내용

Thermal Management LED Packaging
Thermal management considerations
□ Chip on board LED Array
- Higher power density than array of individual LED packages
- Per Chip junction to board thermal resistance similar to packaged LEDs
□ Thermally managed remote phosphor
- Phosphor temperature maintained within 10℃ of junction
- Elevated phosphor temperatures reduce efficacy and cause chromaticity shift
□ Anodized finned heat sink
□ Steady-state junction temperature < 60℃
□ 2.5℃/W junction to ambient Rth
□ 92% of lumens maintained at steady-state

참고 자료

고출력LED패키지기술동향_전자부품9월호
LED조명 산업의 국내외 현황과 산업동향
고효율 LED 칩 기술개발 동향
LED광원기술동향과전망
Lumiles, Cree, Osram, Nichia 발표 자료