Etching and Packaging of Micro System Process

소개글

마이크로시스템공정 레포트로 반도체제조공정에 관한 영어 논문을 작성한 레포트입니다.

목차

1. Introduction
2. Etching
3. Packaging
4. Summary

본문내용

Etching and Packaging of Micro System Process
YJ♡JD
School of Mechanical Design and Automation, Seoul National University of Science and Technology, Seoul, Korea
Abstract
etching technique. Etching is classified into 2 groups depending on method, wet etching and dry etching. Wet etching makes the part that doesn’t have PR pattern melt by using acidic chemicals which reacts with metal. Dry etching forms pattern by means of removing material located on the exposed place by accelerating ion.
Semiconductor package technique which consists of active elements (semiconductor chip) and passive components (resistors, capacitors) is very important technologies that spread very widely. It includes technologies about electronic hardware systems. The roles of package are preventing malfunction that can be caused by vibration, shock, moisture/dust in the air, light and magnetism and connecting electrically with the PCB by attaching lead to the package and passing signal. Also, it releases the

참고 자료

[1] Richard C. jaeger, Introduction to Microelectronic Fabrication
[2]http://www.semipark.co.kr/semidoc/semidocs.asp, basic Resources of semiconductor