Stress Changes of Nanocrystalline CoNi Films Electrodeposited from Chloride Bath
- 최초 등록일
- 2008.07.25
- 최종 저작일
- 2008.06
- 11페이지/
MS 파워포인트
- 가격 2,500원
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소개글
전해 도금 시 Chloride의 첨가에 따른 변화에 대한 실험 자료입니다.
목차
1. Electroplating / Electrodeposition
2. Application of electrode and electroless deposition
3. Advantages and Disadvantages
4. Compositions and operating conditions of Chloride baths
5. Composition and Stress of Chloride baths
6. The surface morphology of CoNi thin films
7. XRD analysis
8. Microstructure and Grain sizes
9. Conclusion
본문내용
Recent Applications
ULSI Application
Copper Metallization : IBM 1997
Replace aluminum Interconnects with copper
MEMS Application
LIGA (or LIGA- like process): 1990
Fabrication Microstructure by Electroforming
RF MEMS, Bio MEMS Fabrication
Packaging Application
UBM (Under Bump Metallurgy): 1997
Fabrication of Ni/Au by Electroless Plating
Advantages and Disadvantages
Advantages
•Low production cost
• Suitable to large scale plating
• rapid deposition rate
• various deposition parameters
• easy scale up and maintenance
Disadvantages
• Contamination or impurities in film
• Reproducibility
• Toxic waste generation
참고 자료
Stress Changes of Nanocrystalline CoNi Films Electrodeposited from Chloride Bath