[반도체공정] 플라즈마 에칭 장비의 구조

소개글

반도체 공정중 플라즈마 에칭 장비에 대한 구조 및 설명을 ppt로 작성했습니다

목차

Etch Equipment`s Structure
Plasma source's Kinds
RIE (Reactive Ion Etching)
Chuck
Trend of Etch Equipment

본문내용

Etch Equipment`s Structure

< Composition of etch equipment >
Sending back department which transfer wafer
from cassette to reaction chamber
Vacuum department which is kept vacuum
Electrode department which breed plasma
for process
According to electrode structure,
classify etch equipment

< Main composition parts >
-Chamber and vacuum system to progress process keeping fixed pressure
-Chuck that can be kept wafer's temperature changelessly at process progress
-Gas supply system that supply gas for process
-Plasma source to breed plasma for process
-RF System to supply energy in plasma source and chuck

참고 자료

Http://www.semibank.net(래디언테크(주))

이종명의 반도체 기술 핸드북

http://www.kirim-s.com/homepage%28k%29/kirim.pdf

공정플라즈마 공정 기초와 응용,Alfred Grill